I am a seasoned semiconductor professional with over 23 years of experience in product development across key domains such as NAND memory, SD/microSD, PCIe NVMe SSD, CXL, PCIe switches, IoT, and Automotive ADAS functional safety. I have contributed to purpose-built connectivity solutions enabling AI-ML infrastructure for hyperscale data centers and cloud computing. My career spans global technology leaders like Hewlett-Packard, Bosch, SanDisk, Western Digital, Micron, and Astera Labs, where I’ve led the development of high-performance, innovative products that shape modern computing and connectivity.
As a technical and business leader, I hold 5 patents from the USPTO and have consistently delivered industry-first technologies. I am honored to be a Fellow Member of IETE, a Senior Member of IEEE, and a Fellow Member of IICSPA, reflecting my active role in advancing semiconductor technologies. My work drives progress in AI/ML, IoT, and automotive safety, reinforcing U.S. leadership in advanced technology.
3.Education qualifications, experience, profile highlights, conferences, publications
Qualification: Bachelor of Engineering in Electronics & Communication from SIT, Bangalore University – India
Professional Profile:
A seasoned Electronics and Communication Engineer with over 23 years of expertise in product development across leading domains of semiconductor technology, including NAND memory, SD/microSD, PCIe NVMe SSD, CXL, PCIe switches, IoT, Automotive ADAS functional safety, and purpose-built connectivity solutions for AI-ML infrastructure in hyperscale environments. A proven track record of delivering high-impact innovations for next-generation cloud computing, automotive safety, and advanced connectivity.
Currently a Senior Principal Firmware Engineer at Astera Labs, CA, I have previously contributed to global tech giants such as Hewlett-Packard, Bosch, SanDisk, Western Digital, and Micron. Holding 5 patents from the USPTO, I am recognized as a leader in advancing semiconductor technologies. A Fellow Member of the Institution of Electronics and Telecommunication Engineers (IETE), Fellow Member of IICSPA, and a Senior Member of IEEE, my work continues to drive innovation, shaping the future of semiconductor products and AI/ML infrastructure worldwide.
LinkedIn: https://www.linkedin.com/in/manjunath-chandrashekaraiah/
Google Scholar: https://scholar.google.com/citations?user=4KVAE8oAAAAJ&hl=en
4. Achievements:
As a Semiconductor Technology Expert and inventor with a proven track record of more than two decades, I have had the privilege of working at globally renowned technology companies such as SanDisk, Western Digital, Micron, and Astera Labs. My career has been defined by the development of innovative semiconductor products that have made a lasting impact on industries ranging from data storage and automotive to AI/ML infrastructure and IoT edge intelligence.
I have led the design and delivery of critical solutions including SD/microSD, PCIe NVMe SSDs, CXL solutions, ADAS, Software-Defined Vehicle solutions, and purpose-built connectivity solutions for AI-ML infrastructure. These innovations have been widely adopted by global customers and have driven advancements in hyperscale data centers, automotive applications, real-time IoT edge intelligence, and high-performance computing systems.
As an inventor, I hold several patents that reflect my passion for pushing the boundaries of technology and creating products that drive efficiency, scalability, and performance. My work continues to shape the future of semiconductor technologies, helping businesses and industries across the world build more intelligent, faster, and more reliable systems.Thanks for recognising my contributions to the professional world and honouring with an award.